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 | The DMS Go+ Series offers comprehensive, handheld solutions to thickness measurement, data recording and data management in a wide range of applications and environments. From simple A-scan verification to B-scan to full Data Recording capabilities, one of the DMS Go+ instruments will meet your corrosion thickness application needs. Choose from three models to match your specific application: DMS Go+ Basic: Simple to use, A-scan verification, rugged and reliable, IP67 sealing Compatible with high quality D-Meter dualelement probes to handle a wide range of corrosion thickness applications. DMS Go+: B-scan (timed) for cross-sectional view Compatible with single element probes for precision thickness measurement and temperature compensated readings. DMS Go+ Advanced: 6 data recording file structures plus 3D & 4D via UltraMATE TopCoat/Auto-V measurement capabilities to eliminate removal of many coatings.
All models feature intuitive, easy-to-use arrow-keypad control, powerful data management and the latest industrial electronics to provide accurate, reliable and comprehensive thickness inspection data. The DMS Go+ Series of A-scan thickness gauges are easily upgradeable to add the additional features and capabilities of the 3 models, and the comprehensive USM Go+ flaw detector capabilities to form a powerful and flexible NDT inspection tool. | |
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 | New 140 micron wireless image detector at a higher resolution than the DXR250U-W and full 60k grey levels. -a-Si TFT (Thin Film Transistor) detector Detector size: 410 x 470mm (16 x 18.5″) -Compliance- -Radiation hardness- DDA sold only inside the armor case: | |
 | DXR500L 12×9.5 Digital Detector including temperature controller, power supply and cabling A static digital detector array providing the highest imageDesigned for exclusive use in Waygate Technologies’ industrial X-ray inspection and CT systems, the DXR500L is able to provide extremely high image quality in production environment. The DXR500L allows easy defect detection. Utilizing Endurance™ technology, developed to reduce radiation wear out and to maximize cost savings. A temperature controller allows for longer calibration intervals and quick, consistent images. DXR500L provides application results efficiently with a cycle time reduction. Benefits
Applications
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 | New 75 micron high resolution detector -IGZO* TFT Detector -75µ pixel pitch (6,66lp/mm) High Resolution -16 bit grayscale, full 60k greylevels available -GOS** scintillator, fast imaging -Detector size: 210 x 260mm (8 x 10″) -Imaging area: 168 x 225mm (7 x 9″) -Imaging pixels: 2240 x 3008 -Active area from edges: 40mm (1.6″ – bottom), 28mm (1.1″ – left) *Indium gallium zincoxide, a more recentsemiconducting material. Having 20-50 times the electron mobility of amorphous silicon. **GOS, Gadolinium Oxysulfide or GadOx
-Communication: wired (tether) or wireless (802.11 n/ac – up to 100m / 330ft) -Power supply: wired with SCU wireless with battery (2 ex., hot swappable) -Operating time: (on battery) up to 8hrs (imaging – 9hrs (stand by) -Unique internal shielding: protecting electronics, improving dda lifetime -Weight (incl. armor case): 4.4kgs (11lbs) -IP Marking: IP65 and IP67
-Compliance: DICONDE compliant, ISO, ASTM, ASME, JIS, KS. Bad Pixel Map and Spatial Resolution Measurement conforms to ASTM E2597 -Radiation hardness: lk Gy (absorbed dose), maximizing dda lifetime – USP! DDA sold only inside the armor case: | |
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